发明名称 INTEGRATED CIRCUIT
摘要 <p>PURPOSE: To securely hold leads arranged, while keeping the compatibility with the conventional integrated circuits. CONSTITUTION: A lead 5 is sandwiched between a bottom conductive plate 7 and a top conductive plate 8. Therefore, arrangement of a plurality of leads 5 is excellently maintained. Insulation is kept between the bottom conductive board 7 and the top conductive board 8, and insulation of the lead 5 is kept by insulation films 7b and 8b. The bottom conductive plate 7 is connected with a ground lead 5B, and the top conductive plate 8 is connected with a power source lead 5A.</p>
申请公布号 JPH0897348(A) 申请公布日期 1996.04.12
申请号 JP19940235608 申请日期 1994.09.29
申请人 KAWASAKI STEEL CORP 发明人 SADAHIRA NAOYUKI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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