PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

摘要

PURPOSE: To provide a photosensitive polyimide resin compsn. excellent in resist characteristics such as sensitivity and having high shelf stability. CONSTITUTION: This photosensitive resin compsn. contains a polyamic acid compd. represented by formula I, a photosensitive aid having a photopolymerizable functional group and a solvent. In the formula I, R<1> is a tetravalent org. group, R<2> is a divalent org. group, (k) is an integer of 5-10,000 and Z is an actinic ray functional group represented by formula II [where each of R<3> -R<7> is a substituent having a photopolymerizable carbon-carbon double bond and (m) is 0 or 1].