发明名称 CERAMIC LID FOR PACKAGE
摘要 PURPOSE: To improve conductivity, thermal conduction, and air tightess, by using an aluminum-nitride-based ceramic material containing a given ratio by volume of a specific metal. CONSTITUTION: A ceramic lid is made of aluminum-mitride-based ceramic material. The ceramic meterial contains 20-80vol.% tungsten, or molybdenum, or both. The resistivity is reduced to 6 to 29×10<-6>Ω.cm, and the conductivity is improved. At the same time the thermal conduction is improved because of added metals. In this case, leakage of He is not observed and a ceramic lid with good airtightness can be obtained.
申请公布号 JPH0897317(A) 申请公布日期 1996.04.12
申请号 JP19940226766 申请日期 1994.09.21
申请人 SUMITOMO METAL IND LTD 发明人 HASHIMOTO MASAYA
分类号 H01L23/02;H01L23/08;(IPC1-7):H01L23/02 主分类号 H01L23/02
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