SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE,申请号JP19940229336-传众专利搜索

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发明名称	SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE
摘要
申请公布号	JPH0897350(A)	申请公布日期	1996.04.12
申请号	JP19940229336	申请日期	1994.09.26
申请人	NEC ENG LTD	发明人	CHIKAMA HIROKI
分类号	H01L23/50;H05K3/34;(IPC1-7):H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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