| 摘要 |
PURPOSE: To accurately detect a position deviation from a designed mounting position of packaging parts even if a substrate is warped and to improve the reliability for judging defect by detecting the height of a substrate surface with a height detector and calculating the image pick-up magnification of a TV camera and then setting an inspection window based on the calculation image pick-up magnification and a designed mounting position. CONSTITUTION: A height detector 103 applies a spot beam to a part where no objects 101 to be inspected are mounted on the substrate on an XY table 102, receives reflection light, and detects the height of the substrate surface. A TV camera image pick-up magnification factor calculation means 107 calculates the image pick-up magnification of a camera 105 from the detected height of the substrate and the focusing distance of the TV camera 105, and sets an inspection window from the image pick-up magnification rate and the designed mounting position data of the objects 101 to be inspected 108. Then, the image picked up by the TV camera 105 is inputted 109 and the inside of the window is subjected to image processing 110 to obtain the shape and image of the target 101, thus judging whether the obtained position and shape of the target 101 is within an allowable range or not by a position detection means 111. |
