| 摘要 |
PURPOSE: To provide a method of mounting an electronic part capable of detecting any defective electronic part and defective connection as well as easily removing electronic part. CONSTITUTION: Conductive particles 13 whereon a thin thermoplastic bonding agent layer 17 is formed are dispersed on a glass substrate 12, a semiconductor chip 19 is put thereon in place. Later, an Au layer 16 is exposed from the thermoplastic bonding agent layer 17 by heating and pressing steps so as to make a bump electrode 18 and an ITO wiring 11 conductive. At this time, since the thermoplastic bonding agent layer 17 supports the semiconductor chip 19 and the glass substrate 12 by feeble bonding force, the conduction test, etc., can be performed in such a state thereby enabling the electronic parts to be rebonded. In such a state, when an insulating resin is injected between the semiconductor chip 19 and the glass substrate 12, both elements can be bonded together.
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