METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a method of manufacturing semiconductor device capable of securing stable bonding and correcting misalignment of the bonded part. CONSTITUTION: Within the manufacturing method comprising the first step of bonding the connecting electrode of a semiconductor chip with the inner lead 5a of a TAB tape and the second step of bonding the outer lead 5b of the TAB tape to a frame inner lead, a junction hole 5c is made in the front end of the outer lead of the TAB tape while the front end of the frame inner lead is previously bent upward to provide a bonding piece 9a. Next, the junction piece of the frame inner lead is engaged with the bonding hole of the outer lead of the TAB tape to be thermal pressure fixed using a bonding tool.