| 摘要 |
<p>PURPOSE: To provide a semiconductor package which has satisfactory electrical property and high radiation property. CONSTITUTION: On one side 2a of a ceramic substrate, such as, an aluminum nitride substrate, a semiconductor device 3 is mounted. On the other side 2b of the ceramic substrate 2, an input/output terminal, such as, a solder bump 5, is formed. A surface wiring layer 4 on the semiconductor device mounting side 2a of the ceramic substrate 2 and the input/output terminal 5 are electrically connected with each other by a pin-shaped conductor 7, such as, a nail screw type pin or bowl screw type pin made of copper, which is inserted in a through-hole 6 provided in the ceramic substrate 2.</p> |
