| 摘要 |
PURPOSE: To suppress the occurrence of solder adhesion or solder whicker and to prevent the continuity failure of a lead and a contact bar by using a probe card and enabling the tip of the needle-shaped straight-line part of a contact needle to contact the area near a package. CONSTITUTION: A contact needle 34 consists of a needle-shaped straight-line part, the succeeding bent part, and a beam and the tip of the needle-shaped straight-line part contacts the area near an IC package 40 of a lead 25 from a lower part. Then, by operating an XYZ stage 30, an IC 4 is placed on a hot plate 13. Then, by rotating the plate 13 by one turn, the IC 4 is heated to a test temperature during the turn. A pressurization mechanism is operated, the IC 4 which is heated by a retention mechanism 32 is taken out, and the stage 30 is operated and the IC 4 is moved onto a probe card 35. Further, a mechanism 33 is operated and the lead 25 is pressed against the tip of the needle 34, an electrical signal is supplied to the lead 25 via the needle 34 from a measurement part 19, and then the operation test of IC 4 is performed. |
