| 摘要 |
PURPOSE: To enhance the bonding strength of alloy wires to pads by collecting the pads on one side of a substrate for the purpose of facilitating bonding, then reducing heat conductivity because of the high resistance of the alloy wires, enhancing the strength of the wires, and securing the wires in place with pastes. CONSTITUTION: Electrodes on the back of an insulating substrate 2 are taken out onto the other side of the insulating substrate 2 via conducting films provided at the corners of the insulating substrate 2, and electrode pads 8, 10 are collected on one side of the substrate. Noble-metal high-resistance alloy wires 12 made from Pt-W, Pt-Pd, Pt-ZrO2 , Au-Pd-Mo, etc., are welded to the electrode pads 8, 10, are covered with conducting pastes 14 to reinforce bonding to the pads, and welded to external terminals 16. |
