| 摘要 |
PURPOSE: To prevent the cracking to be generated by the thermal strains and stresses of a single crystal substrate occurring in hermetic sealers and to improve reliability by providing the rear surface of the Si substrate with a reinforcing material having the thermal expansion characteristics substantially equal to the thermal expansion characteristics of these hermetic sealers. CONSTITUTION: The rear surface of the Si substrate 1 is provided with the reinforcing material 8 having the thermal expansion characteristics substantially equal to the thermal expansion characteristics of the hermetic sealers 11 to 16. The thermal strains of the Si substrate 1 with the hermetic sealers 11 to 16 are generated by the internal temp. distributions and ambient temp. fluctuations of a mounting device even after mounting on a circuit board. The thermal strains by such temp. changes and distributions are relieved by a method of unifying the constituting materials of the hermetic sealers 11 to 16 and more particularly the constituting materials of frames 11, 15 and a hermetic cap 16 for which the metallic materials are frequently used, using the reinforcing plate 8 of the shape equal to the shapes of the hermetic sealers 11 to 16 with the same materials as these materials and joining the reinforcing plate 8 in the part opposite to the hermetic sealing part. The thermal strains generated between the hermetic sealers 11 to 16 and the Si substrate 1 are offset by the thermal strain generated between the reinforcing plate 8 and the Si substrate 1. |
