METHOD AND DEVICE FOR ASSEMBLING SEMICONDUCTOR DEVICE

摘要

PURPOSE: To enable the lead on an inner lead to be adjusted so that an appropriate pressure per unit area may be applied to a bonding surface corresponding to the variation in the processed lead width by a method wherein the reference tool load is varied depending on the measured values of inner lead width. CONSTITUTION: Inner leads 2 are aligned with the protrusion electrodes 3 on a semiconductor chip 4 so as to bond the inner leads 2 to the protrusions 3 by pressurizing the inner leads 2 downward using a tool 1. At this time, a reference lead width and an optimum reference tool load to be exerted by the tool 1 corresponding to the reference lead width are set for inner lead bonding. Next, the width of actually carried inner leads to be bonded is measured and compared with the reference lead width. Finally, the reference tool load is altered arbitrarily depending on the difference between the reference lead width and the measured lead width or the ratio of the measured lead width to the reference lead width so that the inner leads 2 and the protrusion electrodes 3 may be bonded to one another by the tool load fitted to the actual lead width.