| 摘要 |
<p>An apparatus for bonding an anisotropically electroconductive tape (2) onto a substrate (4) includes a tape supply unit (21) for supplying a length of leader tape (1) having a length of anisotropically electroconductive tape (2) bonded to one of opposite surfaces thereof; a tape transport unit (22) for transporting the length of leader tape (1) so supplied in a transport direction (M); a cutting unit (23) for cutting only the length of anisotropically electroconductive tape (2) to provide an anisotropically electroconductive tape segment (107) of a predetermined length; a substrate positioning unit (10) for positioning the substrate (4) to which the anisotropically electroconductive tape segment (107) is to be bonded; and a tape applicator unit (19) for pressing the anisotropically electroconductive tape segment (107) against the substrate (4) to bond the former to the latter. The cutting unit (23) includes two cutter blades (93, 94) for forming respective incisions in the length of anisotropically electroconductive tape (2) and a length of adhesive tape used to remove a piece of anisotropically electroconductive tape (2) bound between the incisions to leave a space of separation (95) dividing the length of anisotropically electroconductive tape (2) into the anisotropically electroconductive tape segment (107) and the remaining anisotropically electroconductive tape.</p> |
