发明名称 Ceramic circuit board and manufacturing method thereof.
摘要 A conductor circuit (12) made of aluminum is provided on a green sheet (10), the primary material of which is ceramic powder. The green sheets (10) are laminated and integrated into one body so that the conductor circuit (12) is not exposed onto the surface but is covered with the green sheet (10). The laminated body is fired at the firing temperature not lower than 660 DEG C and a portion of the inner conductor circuit of the thus obtained sintered body is then exposed onto a surface of the substrate. <IMAGE>
申请公布号 EP0670598(A3) 申请公布日期 1996.04.10
申请号 EP19950301373 申请日期 1995.03.02
申请人 SHINKO ELECTRIC INDUSTRIES CO. LTD. 发明人 HORIUCHI, MICHIO;HARAYAMA, YOICHI
分类号 C04B35/64;H01L21/48;H05K1/03;H05K1/09;H05K3/24;H05K3/40;H05K3/46 主分类号 C04B35/64
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