Structures for filters and/or resonators

摘要

A structure forming a resonator or a filter for a multichip module or surface mount assembly comprises a chip of a high dielectric constant ceramic material such as lead-barium-neodymium-titanate or zirconium-titanium-stannate with a ground plane on one major surface and a stripline or coplanar waveguide metallisation pattern on the other major surface forming for example one or more short lengths of transmission line. The metallisation pattern is arranged to be connected to conductors on the multichip module or surface mount substrate by flip chip solder bonding.