Multi-layer electronic circuit package with dielectric polymer layers having different optical absorption strength and method of forming it

摘要

A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first and second optical absorbencies being different from each other. A first layer of one of the organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of a different organic polymeric material with a different optical absorbency to the material in the first layer overlays the first layer.