发明名称 |
Printed circuit manufacture |
摘要 |
<p>In the manufacture of a printed circuit board a sacrificial tin-lead layer is deposited on the surface of the board by electroplating. Holes are then formed in the board by UV laser ablation. Debris from the ablation process is adsorbed on the sacrificial layer. The sacrificial layer is then removed by means of a chemical stripping process, along with the debris. <IMAGE></p> |
申请公布号 |
EP0706309(A1) |
申请公布日期 |
1996.04.10 |
申请号 |
EP19950306675 |
申请日期 |
1995.09.21 |
申请人 |
INTERNATIONAL COMPUTERS LIMITED |
发明人 |
FARRAR, SIMON;TAYLOR, NEIL |
分类号 |
B23K26/00;B23K26/16;B23K26/18;B23K26/38;H05K3/00;H05K3/34;H05K3/42;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|