发明名称 Film carrier tape for use in tape automated bonding.
摘要 A film carrier tape for use in TAB, having a lead wiring of a desired shape, and formed on a base film having a sprocket hole for conveyance and positioning, for connecting electrode pads of a semiconductor chip, includes a corner slit formed in at least one portion of four corner portions of a suspender positioned between a device hole and outer lead holes so as to vertically communicate. <IMAGE>
申请公布号 EP0661743(A3) 申请公布日期 1996.04.10
申请号 EP19940120228 申请日期 1994.12.20
申请人 NEC CORPORATION 发明人 URUSHIMA, MICHITAKA
分类号 H01L21/60;H01L23/28;H01L23/495 主分类号 H01L21/60
代理机构 代理人
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