发明名称 |
Single layer leadframe design with groundplane capability |
摘要 |
A method of making an electronic package. The method includes the step providing a leadframe of a single layer of material. The leadframe includes a semiconductor chip support, a plurality of signal leads, and a common ground portion substantially surrounding the chip support portion. A semiconductor chip having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor chip support of the leadframe. Selected ones of the signal sites of the semiconductor chip are selectively electrically connected to respective ones of the signal leads of the leadframe and selective ones of the ground sites of the semiconductor chip are selectively electrically connected to the common ground portion of the leadframe. Each of the signal leads of the leadframe are electrically isolated from each other and from the common ground portion of the leadframe. <IMAGE> |
申请公布号 |
EP0706213(A2) |
申请公布日期 |
1996.04.10 |
申请号 |
EP19950111428 |
申请日期 |
1995.07.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DIFFENDERFER, STEVEN JOEL;SHAUKATULLAH, HUSSAIN |
分类号 |
H01L23/50;H01L23/433;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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