发明名称 |
Poly(amic acid) solution, use thereof and polyimide film or polyimide-coated material obtained therefrom |
摘要 |
<p>This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate.</p> |
申请公布号 |
EP0705862(A1) |
申请公布日期 |
1996.04.10 |
申请号 |
EP19950115808 |
申请日期 |
1995.10.06 |
申请人 |
UNITIKA LTD. |
发明人 |
ECHIGO, YOSHIAKI;OKAMOTO, SHOJI;YAMADA, HIROSHI;TOMIOKA, ISAO;IWAYA, YOSHIAKI |
分类号 |
C08G73/10;C09D179/08;H05K1/03;(IPC1-7):C08G73/10 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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