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发明名称
METHOD FOR FORMING FILM ON SEMICONDUCTOR WAFER
摘要
申请公布号
JPH0897157(A)
申请公布日期
1996.04.12
申请号
JP19940235234
申请日期
1994.09.29
申请人
SONY CORP
发明人
AZUMA YUJI
分类号
C23C16/50;H01L21/205;H01L21/31;(IPC1-7):H01L21/205
主分类号
C23C16/50
代理机构
代理人
主权项
地址
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