发明名称 AUTOMATIC SOLDERING METHOD, AUTOMATIC SOLDERING DEVICE, JET HOLE TYPE SOLDER GUSHING NOZZLE AND FLUX APPLYING BRUSH DEVICE
摘要 PURPOSE: To enable exact and efficient operation by injecting molten solder from small-diameter injection holes to form conical build-ups and executing soldering across the solder jets by increasing or decreasing injection force or the depth of a molten solder pool. CONSTITUTION: The molten solder 19 injected upward from injection hole type solder jet nozzles when an injection propeller is rotated by a motor after the solder is melted by a heater and is controlled in temp. in a solder jet nozzle device 16. The surface of the molten solder pool 170 existing atop the injection hole type solder jet nozzles is raised by the injection force and the conical solder jets 171 are built up by the surface tension of the solder. The height of the jets is adjusted to meet a stabilizer W for soldering by controlling the number of revolutions of the injection propeller. Coil terminals W1 , W2 are preheated in a fore stage and are soldered in a post stage at the time the stabilizer W crosses the solder jets 171 by tact transportation. As a result, the exact and efficient operations are automated.
申请公布号 JPH0890217(A) 申请公布日期 1996.04.09
申请号 JP19940248709 申请日期 1994.09.16
申请人 TAISEI KAKEN:KK 发明人 MATSUBARA YOSHIMASA
分类号 B23K1/00;B23K1/08;B23K3/00;B23K101/36;H01R43/02;H05K3/34;(IPC1-7):B23K1/00 主分类号 B23K1/00
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