IC CARD

摘要

PURPOSE: To improve the protection of an IC module and an IC chip by a method wherein bending action from outside is absorbed by a card base material when the bending action is applied to an IC card from outside. CONSTITUTION: A card base material 30 wherein a recess part 35 for mounting an IC module is formed on its surface, and the IC module 11 installed in the recess part 35 of the card base material 30 are provided. The IC module 11 is composed of a substrate 12 and an IC chip 17 fixed to the substrate 12. The card base material 30 is made of vinyl chloride, and Young's modulus E of the card base material is within a range of 2.00×10<2> kgf/mm<2> <=E<=2.65×10<2> kgf/- mm<2> .