发明名称 Heat seal connector with integral parting agent
摘要 A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).
申请公布号 US5507038(A) 申请公布日期 1996.04.09
申请号 US19940338973 申请日期 1994.11.14
申请人 MOTOROLA, INC. 发明人 COOK, KENNETH E.;CARR, JONATHAN;CHERASO, JOHN P.
分类号 H04B1/08;H05K1/09;H05K3/00;H05K3/36;(IPC1-7):H04B1/08 主分类号 H04B1/08
代理机构 代理人
主权项
地址