| 摘要 |
<p>PURPOSE: To simplify a driving circuit and to reduce the manufacturing cost by conducting one output pad array provided on both the long sides of the rear surface of a driving circuit element to the conductive pattern layer of the one column of the circuit board. CONSTITUTION: An electrically insulating ceramic board 14 made of alumina, etc., is provided on a heat radiating plate made of Al, etc., a heat storage layer made of glass is formed thereon, and further a resistor film made of TaN, etc., and an electrode layer made of Al, etc., are formed, Then, a common electrode 16, a heat generating resistor 17, individual electrodes 18 are provided by photolithography to form a thermal head 12. An FPC 20 is formed of a plurality of conductive pattern layers and resin layers, a drive IC 23 is placed thereon, and fixed by face down via solder bump. This head is remarkably reduced in the influence of thermal stress, and a distortion due to the thermal expansion of a circuit board practically becomes no problem.</p> |
