发明名称 SURFACE TREATMENT OF SUBSTRATE
摘要 PURPOSE: To treat the surface of a substrate by the plasma generated with a low voltage in a short period of time by coating the opposite surfaces of counter electrodes with a metal oxide and generating the discharge plasma in a gaseous mixture composed of reactive gases and an inert gas near the atm. pressure. CONSTITUTION: The upper metallic electrode 4 and lower metallic electrode 5 having a perforated structure are disposed to face each other in a treating vessel 2 having a discharge port 11. A metallic plate 6 coated with the metal oxide film is placed on at least one of these electrodes, for example, the lower metallic electrode 5 and a substrate 7 is arranged thereon. The metal oxide preferably contains a mixture composed of 5 to 50wt.% TiO2 and 50 to 95% Al2 O3 or ZrO2 and the metallic plate is preferably coated by thermal spraying with this metal oxide at a thickness of 10 to 1000μm. The reactive gases and the inert gas are then supplied from gas introducing ports 8, 9 and are mixed in a plasma treating section 3. The voltage is impressed to the electrodes under the pressure of such gaseous mixture near the atm. pressure to generate the discharge plasma. The active species excited by this plasma are brought into contact with the substrate surface, by which the substrate surface is reformed.
申请公布号 JPH0892747(A) 申请公布日期 1996.04.09
申请号 JP19940227751 申请日期 1994.09.22
申请人 SEKISUI CHEM CO LTD 发明人 YUASA MOTOKAZU;KAWAI SHIGEMASA
分类号 C23C16/40;C08J7/00;C23C16/50;C23C16/509;(IPC1-7):C23C16/50 主分类号 C23C16/40
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