发明名称 METHOD OF FORMING COPPER ALLOY LAYER ON THE SURFACE OF CERAMIC
摘要 PURPOSE: To form an easily processable copper alloy layer on the surface of a ceramic. CONSTITUTION: Metallized component powder is coated on the surface of a ceramic and a metallized layer having a thickness of 5-20μm is formed by heat-treatment, then the metallized surface is made to irregular state by a shot blast processing and a copper alloy layer having a thickness of 10-500μm is formed on the metallized surface by flame coating. The resultant ceramic parts material having a copper alloy layer is readily processable of fine correcting of the surface because the copper alloy has excellent processability and the parts material shows a character not missing the characteristics of ceramic such as low thermal expansion, high rigidity and light weight because the copper alloy layer is thin.
申请公布号 JPH0891967(A) 申请公布日期 1996.04.09
申请号 JP19940246798 申请日期 1994.09.16
申请人 NIPPON STEEL CORP 发明人 SHINPO AKIHIRO;UEKI MASANORI;MIYAGAWA HIROSHI;MORITA HIDEHIKO
分类号 C04B41/90;C04B41/52;(IPC1-7):C04B41/90 主分类号 C04B41/90
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