发明名称 |
METHOD OF FORMING COPPER ALLOY LAYER ON THE SURFACE OF CERAMIC |
摘要 |
PURPOSE: To form an easily processable copper alloy layer on the surface of a ceramic. CONSTITUTION: Metallized component powder is coated on the surface of a ceramic and a metallized layer having a thickness of 5-20μm is formed by heat-treatment, then the metallized surface is made to irregular state by a shot blast processing and a copper alloy layer having a thickness of 10-500μm is formed on the metallized surface by flame coating. The resultant ceramic parts material having a copper alloy layer is readily processable of fine correcting of the surface because the copper alloy has excellent processability and the parts material shows a character not missing the characteristics of ceramic such as low thermal expansion, high rigidity and light weight because the copper alloy layer is thin.
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申请公布号 |
JPH0891967(A) |
申请公布日期 |
1996.04.09 |
申请号 |
JP19940246798 |
申请日期 |
1994.09.16 |
申请人 |
NIPPON STEEL CORP |
发明人 |
SHINPO AKIHIRO;UEKI MASANORI;MIYAGAWA HIROSHI;MORITA HIDEHIKO |
分类号 |
C04B41/90;C04B41/52;(IPC1-7):C04B41/90 |
主分类号 |
C04B41/90 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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