| 摘要 |
<p>An apparatus for burn-in test comprising, a socket body including an accommodation groove in which an integrated circuit chip is accommodated to be tested, a step sill portion formed around the accommodation groove, a plurality of inner leads formed on the step sill portion, a plurality of outer leads protruded from the socket body and electrically connected to said inner leads through the socket body, and a supporting element attached to opposite inside walls of the accommodation groove to support the integrated circuit chip, and a method for burn-in test comprising the steps of: (a) mounting an integrated circuit chip to be tested in the accommodation groove; (b) bonding pads of the integrated circuit chip with the corresponding inner leads through a plurality of wires; (c) mounting the socket body on a test board by the outer leads and applying test pattern signals to the integrated circuit chip through the inner and outer leads in the condition of high temperature and high voltage; and (d) severing and removing the wires.</p> |
