ID chip card mfr.

摘要

In the mfr. of an identity card, esp. containing an electronic and/or electrical component in a layered structure, at least one intermediate layer contg. the component is held in a floating action by an amount of adhesive applied at least to one inner side. It is increasingly compressed by heat and pressure, together with limit stops for a given layer thickness, and then hardened. The electronic and/or electrical component is embedded in the adhesive intermediate layer to be held within the finished card. Also claimed is an appts. for the mfr. of the card and having upper and lower plates (21, 22) which are held apart by a distance holder (24) in the end position, according to the thickness of the card (10) layers. Pref. the adhesive is an acrylic adhesive.