发明名称 Einzelband-Formvorrichtung
摘要 <p>Electronic components, chips, are moulded in a single-strip moulding apparatus. The products to be moulded are placed in a mould consisting of two halves, one of the halves whereof displays recesses for receiving a component, which half is connected via a channel with a cavity for receiving a quantity of moulding material. After use the mould must be cleaned and the moulded product carried away. This is carried out by a cleaning-discharge unit combined into a unit.</p>
申请公布号 DE68925820(D1) 申请公布日期 1996.04.04
申请号 DE1989625820 申请日期 1989.11.24
申请人 FICO B.V., HERWEN, NL 发明人 VENROOIJ, JOHANNES LAMBERTUS GERARDUS MARIA, NL-6921 KG DUIVEN, NL;VERWOERD, WOUTER BASTIAAN, NL-6581 RK MALDEN, NL
分类号 B29C31/06;B29C31/08;B29C33/22;B29C33/24;B29C33/72;B29C37/00;B29C43/02;B29C43/34;B29C45/02;B29C45/14;B29C45/42;B29C45/66;B29C45/67;B30B1/10;B30B1/32;B30B15/00;H01L21/00;(IPC1-7):B29C33/72;B29C43/50;B29C43/18 主分类号 B29C31/06
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