发明名称 |
Microchipsmeltveiligheid. |
摘要 |
A microchip fuse is disclosed which includes a casing constructed from box-like upper and lower members. On the end surfaces of both members, electrode sections are provided which are formed by plating metal onto a sintered conductive paste on the end surfaces. Grooves are provided on the members and filled with insulating material. A fusible element extends through the insulating material and the inner surface as formed when the both members are jointed together. The end portions of the fusible element are soldered to the electrode sections. A hollow portion is provided in the casing adjacent to the inner space by way of a thin wall to dampen the pressure of a gas generated during the interruption process. |
申请公布号 |
NL1000560(A1) |
申请公布日期 |
1996.04.03 |
申请号 |
NL19951000560 |
申请日期 |
1995.06.14 |
申请人 |
SOC CORPORATION |
发明人 |
HIROO ARIKAWA;AKIHIKO KANEHARA;MANABU FURUSAWA;KOH ISHIMURA |
分类号 |
H01H85/165;H01H85/00;H01H85/041;H01H85/045;H01H85/143;H01H85/175;H01H85/43 |
主分类号 |
H01H85/165 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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