| 摘要 |
Transmitter module for optical interconnections, comprising a metal container housing (A) an optical emitting device (E), an integrated circuit (B) containing the driving circuit of the emitting device and an optical fibre (I) extending outside the container, the emitting device being mounted on a metallic ground area (D) realized on the integrated circuit. The cathode is electrically connected to the ground area and the anode is connected to a second metal area, connected with the output of the driving circuit. The module uses a type of assembly which minimises problems due to the length of the connecting wires, to parasitic effects and to the effects of signal reflections due to impedance mismatching. It also requires reduced power for its operation and it is provided with a structure facilitating dissipation, in that said first, ground area (D) extends over the surface of the integrated circuit by means of metallization strips (C), acting as thermal dissipation means for said optical emitting device (E). <IMAGE> |
