发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PURPOSE: To provide an electronic component mounting apparatus in which the processing speed of an empty tape fed from a part feeder can be increased and the size of the entire apparatus can be reduced by effectively utilizing a narrow space. CONSTITUTION: A transfer head 25 is index-rotated along a rotary head 2 to pick up an electronic component C provided at the tape 17 of a part feeder 9 on a table 7 and to place it on a board 5 on an X-Y table. The front end of the feeder 9 is disposed under the head 2, and a space S2 under the front end and a space S1 under the head 2 are formed as a board 5 moving space S3. A cutter 45 is disposed directly under the head 2, the empty tape 17 fed forward from the feeder 9 is cut by the cutter 47, and fine chips 17' are sucked by a suction tube 48 to be recovered.
申请公布号 JPH0888497(A) 申请公布日期 1996.04.02
申请号 JP19950261237 申请日期 1995.10.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIDESE WATARU
分类号 B23P21/00;H05K13/00;H05K13/04 主分类号 B23P21/00
代理机构 代理人
主权项
地址