发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE: To obtain a resin-sealed semiconductor device which prevents an island and a suspender for a TAB tape from moving. CONSTITUTION: An IC chip 5 is placed on an island 2, the IC chip 5 and LF leads 1 are connected by TAB leads 4 which are supported by a suspender 3, and the whole assembly is sealed with a sealing resin 7. At this time a distance HM from the surface of the island up to the rear surface 'of the suspender, a distance HU from the surface of the suspender up to the surface of a resin package and a distance HL from the rear surface of the island up to the rear surface of the resin package are made nearly equal. That is to say, HM≈HU≈HL. Consequently, since the circulation route of an injection resin has an equal resistance, the resin flows equally, so that the suspender or the like does not move.
申请公布号 JPH0888312(A) 申请公布日期 1996.04.02
申请号 JP19940244920 申请日期 1994.09.14
申请人 NEC CORP 发明人 TSUNODA YOICHI
分类号 H01L21/60;H01L23/02;H01L23/04;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L21/60
代理机构 代理人
主权项
地址