发明名称 THIN-FILM CAPACITOR AND BOARD WITH BUILT-U//IN THIN-FILM CAPACITOR
摘要 <p>PURPOSE: To obtain a thin-film capacitor whose impedance is reduced by using a board made of a high-melting-point metal, which is used as a decoupling capacitor, which restrains a change in the characteristic of an electronic component requiring a high-speed property and which increases the reliability of the electronic component. CONSTITUTION: A thin-film capacitor is constituted in such a way that it contains a first electrode 17 which is composed of a metal board 12 composed of Mo and of an oxidation-preventive film 16 composed of Pt and a second electrode 18 which is composed of Cr electrodes 14 and a Cu electrode 15 which are arranged and installed so as to face the first electrode 17 and that an STO film which is composed of a dielectric 13 is interposed between the electrodes.</p>
申请公布号 JPH0888318(A) 申请公布日期 1996.04.02
申请号 JP19940225417 申请日期 1994.09.20
申请人 FUJITSU LTD 发明人 TANMACHI HARUO
分类号 H05K1/16;H01G4/12;H01G4/33;H01L27/01;H05K3/46;(IPC1-7):H01L27/01 主分类号 H05K1/16
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