| 摘要 |
<p>PURPOSE: To provide lamination compound parts where parts packaging density can be improved and at the same time soldering failure can be reduced. CONSTITUTION: When a bump 7 consisting of solder in a certain shape is formed on a land (terminal electrode) 8 for bump on the reverse side which is conductively connected to an external electrode 4 formed on the side surface of lamination compound parts 1 and the lamination compound parts 1 are mounted to an electronic parts mounting substrate 5 such as a mother board, a land 9 for soldering is formed on the electronic parts mounting substrate 5 corresponding to the bump 7 in advance, and the bump 7 is soldered to the land 9. Since the land 9 for soldering is formed under the low surface of the lamination compound parts 1, only a packaging area which is nearly identical to the parts shape is required, thus improving the parts packaging density. Also, even if the circuit of the lamination compound parts 1 becomes complex and the number of I/O terminals increases, it is not necessary to extremely narrow the pitch of the bump 7, thus easily performing soldering and reducing soldering failure as compared with before.</p> |
