POSITIVE PHOTOSENSITIVE COMPOSITION

摘要

PURPOSE: To obtain a chemical amplification type positive photo-resist having a highγ-value and applicable to half-micron lithography using light in a far UV region by incorporating a polyoxyalkylene compd. CONSTITUTION: A polyoxyalkylene compd. is incorporated into a positive photosensitive compsn. contg. 100 pts.wt. alkali-soluble resin, 0.005-30 pts.wt. optical acid generating agent and 1-70 pts.wt. compd. which is made alkali-soluble by a reaction with an acid generated under light as essential components. The polyoxyalkylene compd. is not especially limited but it is desirable that the compd. has >=140 deg.C b.p. under atmospheric pressure so as to prevent volatilization at the time of baking in a resist image forming process. The resultant photosensitive compsn. has high resolving power and is applicable to the production of a semiconductor integrated circuit having a high degree of integration.