摘要 |
PCT No. PCT/JP94/01035 Sec. 371 Date Feb. 21, 1995 Sec. 102(e) Date Feb. 21, 1995 PCT Filed Jun. 28, 1994 PCT Pub. No. WO95/01393 PCT Pub. Date Jan. 12, 1995.This invention provides a thermoplastic resin composition comprising a thermoplastic resin and 0.1 to 100 parts by weight, per 100 parts by weight of the thermoplastic resin, of an imide compound prepared, e.g., by dehydration condensation of 1,2,3,4-butanetetracarboxylic acid or a monoanhydride or a dianhydride thereof with a primary amine, and a method of molding the resin composition.
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