发明名称 METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE: To improve the heat resistance of an eyelet part by striking the eyelet whose surface is subjected to roughening treatment in advance into a specific reference hole for alignment between an inner-layer plate and a first prepreg, deforming the tip of the eyelet, and caulking an inner-layer plate and the prepreg. CONSTITUTION: Two inner-layer plates 3 where a wiring pattern is formed on front and reverse inner surfaces are laminated via a specific number of first prepregs 4a in-between. A reference hole is drilled at the specific position and is caulked by an eyelet 1 whose surface is roughened. In this manner, the caulked piece is heated and pressed for forming one piece by overlapping an outer-layer copper foil 5 via a second prepreg 4b. Heat-resistance property can be improved without causing interlayer peel-off at a hightemperature treatment including solder when mounting parts.
申请公布号 JPH0888467(A) 申请公布日期 1996.04.02
申请号 JP19940247162 申请日期 1994.09.14
申请人 TOSHIBA CHEM CORP 发明人 SATO NORIYUKI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址