| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure for maintaining a semiconductor chip at a roughly constant temperature or with temperature variations within a limited range in an environment where the power consumption of the chip is variable. SOLUTION: A package structure is provided, which contains a temperature sensor for monitoring the present temperature of a chip, a fan 14 for changing air current over a heat sink 13, which comes into thermal contact with the chip, and a control means, which responds to the temperature sensor to control the fan 14 in such a way that when the temperature of the chip rises, the air current is increased and when the temperature of the chip drops, the air current is decreased. |
