| 摘要 |
PURPOSE: To improve the accuracy of a damp heat test by polishing a lead end by a polishing yarn coated with polishing agent between humidified lead terminals, removing deposit of the terminal, and then conducting the characteristic test of a semiconductor device. CONSTITUTION: A polishing yarn 4 uses a nylon yarn having a diameter of 0.1mm. The yarn 4 is extended under tension between upper and lower wheels 7 by using a polishing agent coating unit. Polishing agent 5 is adhered by rotating the yarn 4 round by round. Organic residue 3 between lead terminals 2 is scraped while sequentially rotatably sliding the yarn 4 between the terminals 2 of a package set to a polishing material fixing base 6 on the way. Thus, leakage between the terminal can be avoided, characteristic check is accurately conducted, and the accuracy of a damp heat test can be improved. |
