| 摘要 |
<p>PURPOSE: To obtain a semiconductor device which miniaturizes a package size and, at the same time, which restrains a lead terminal from being deformed. CONSTITUTION: A semiconductor device is formed such a way that the whole circumference including the front stand the rear excluding an external connection part connected to electrode pads 12a for a semiconductor chip 12 is resin- packaged. In the semiconductor device, the external connection part which is larger than the electrode pads on a lead piece 23 arranged near the respective electrode pads in a state that the external connection part is connected to the respective electrode pads is exposed in a recessed state 2a from the resin surface on the formation side of the electrode pads.</p> |
