发明名称 Method of manfacturing a chip-type composite electronic part
摘要 When resistor elements, common electrodes and individual electrodes are formed on a substrate, a disconnected portion, i.e., open portion is formed in one of the common electrodes. After the respective resistor elements are trimmed, the disconnected portion of the one common electrode is bridged by a conductor.
申请公布号 US5502885(A) 申请公布日期 1996.04.02
申请号 US19940284805 申请日期 1994.08.02
申请人 ROHM CO., LTD. 发明人 HANAMURA, TOSHIHIRO;SAKAI, KAORU
分类号 H01C7/00;H01C1/16;H01C13/02;H01C17/00;H01C17/24;H01C17/242;(IPC1-7):H01C17/28 主分类号 H01C7/00
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