发明名称 Manifold for injection molding apparatus
摘要 A heated manifold system for use in the distribution of heated plastic resins to the various cavities of injection molds for thermoplastic materials. The manifold main structure consists of modular components of similar cross-section that are nested into each other by employing similar slots cut out at the points of intersection of the components. The thermoplastic resin passages are bored longitudinally in each modular component; transverse bores at each intersection provide resin passages between the longitudinal bores. The system includes heated nozzles which have slots to receive cartridge heaters and heater covers, also spring clips to retain the covers and heaters, which can rotate around the shank of the nozzle to allow easy replacement of the cartridge heaters in the event of failure. Internal sealed liquid-filled channels or highly conductive metal rods are used to equalize the temperature of the nozzle from one extremity to the other.
申请公布号 US5503545(A) 申请公布日期 1996.04.02
申请号 US19940278506 申请日期 1994.07.21
申请人 BENENATI, SALVATORE 发明人 BENENATI, SALVATORE
分类号 B29C45/17;B29C45/27;(IPC1-7):B29C45/22;B29C45/72 主分类号 B29C45/17
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