发明名称 MULTILAYER PRINTED-COIL BOARD AND MANUFACTURE THEREOF
摘要 <p>PURPOSE: To provide a multilayer printed-coil board capable of increasing piece extracting numbers from one board without externally exposing conductor part excluding the outer connecting terminal even if it is externally cut off. CONSTITUTION: The multilayer printed-coil board is provided with a laminated layer body 3 comprising a plurality of laminated base materials 2, also a plurality of spiral patterns 4 comprising coils 6, a core containing hole 7 in the inner region of the coil 6 and a plurality of sectional plated through holes 10. The patterns 10 can be pulled out of specific positions of the spiral patterns 4 passing through the inside of the laminated body 3. At this time, respective pulled out patterns 4 are electrically connected to respective sectional plated through holes 10. Accordingly, in such a constitution, respective sectional plated through holes 10 can fill the roles of the outer connecting terminals.</p>
申请公布号 JPH0888122(A) 申请公布日期 1996.04.02
申请号 JP19940220672 申请日期 1994.09.14
申请人 IBIDEN CO LTD 发明人 DEMURA AKIHIRO
分类号 H05K1/16;H01F17/00;H05K3/46;(IPC1-7):H01F17/00 主分类号 H05K1/16
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