Heat sinking assembly for electrical components

摘要

A heat sinking assembly for dissipating thermal energy from heat generating electrical components wherein the heat sinking assembly includes a component support member and a housing which surrounds and clamps the electrical components to the heat sink wherein the components are not heat sunk until the first half of the housing assembly is attached to the circuit board or to the second half of the housing assembly. The clamping force for the electrical components may also be varied for optimum heat transfer.