| 摘要 |
PURPOSE: To provide a face-down bonding method and the connection material using thereof by a method wherein no mulfunction is generated even when the pitch of the connection terminal electrodes of an electronic part is narrowed. CONSTITUTION: Through holes 3c are formed corresponding to the terminal electrodes 1a provided on the bottom face of a semiconductor integrated circuit 1, a connection-sealing sheet 3, consisting of a resin sheet 3a on which conductive resin 3b is filled in the through holes 3, is interposed between the semiconductor integrated circuit 1 and a circuit substrate 2. After the terminal electrodes 1a, the conductive resin 3b and surface electrodes 2b have been aligned, they are closely adhered, and the resin sheet 3a is hardened. As a result, the terminal electrodes 1a and the surface electrodes 2b of the circuit substrate 2 are conductively connected by the conductive resin 3b. Consequently, a connecting operation can be simplified, high reliability can be obtained, and the pitch of the terminal electrodes 1a can also be narrowed. |
