| 摘要 |
<p>PURPOSE: To obtain a semiconductor device which is easily surface mounted and has high heat dissipation properties by using a conductor pattern at the center of a TAB board as a semiconductor chip placing part, providing an opening in a chip placing area in an insulating tape, exposing the conductor pattern, and integrally supporting the placing part and the periphery with the end of a lead. CONSTITUTION: A solder ball 5 protrudes from the contact hole of an insulating film 13 so formed as to cover the lead 1b of the peripheral edge of a TAB board, and further a conductor pattern disposed at the center of the board is remained as a semiconductor chip placing part 1a. Further, the insulating tape of the board has an opening at the chip placing area as well, the pattern is exposed, and the peripheral edge of the part 1a and the end of the lead are integrally supported except the bonding area of a lead 1b. In this case, a hole 7b is formed at the bonding area of the tape. Thus, the surface mounting is facilitated, and heat dissipation properties can be improved.</p> |
