| 摘要 |
PURPOSE: To realize a resin-sealed semiconductor device which can be mounted at high density in its width direction and whose bonding pads are not required to be laid out specially in the circuit design of a semiconductor element. CONSTITUTION: A resin-sealed semiconductor device in which a semiconductor element is resin-sealed has a structure in which outer leads 4 are derived from both side faces of a resin-sealed part 6. In the resin-sealed semiconductor device, positions of the outer leads 4 which have been derived from one side face of the resin-sealed part 6 and positions of the outer leads 4 which have been derived from the other side face of the resin-sealed part 6 are dislocated from each other by 1/2 of a pitch of the outer leads 4. The pitch P and the width b of the outer leads 4 are selected in such a way that a relationship of P>=4b is established. |
