| 摘要 |
An electrical integrated modular power node includes a power module having a common backplane with a plurality of bus bars for supplying the power requirements for the node, functional components and circuitry for connection through selected bus bars to a power supply for providing loads with power as required thereby with individual functional modules providing geometrical packages having bounding surfaces conforming to bounding surfaces of adjacent modules including the power module, for enclosing and supporting functional components and circuitry design so the conforming surfaces of the modules abut with one another in a position to be connected at abutting surfaces with at least some of the modules facing the power module to connect to connectors on the bus bars providing power as required by the load to which circuitry within the connected module is connected with the connectors mechanically supporting the modules relative to power module and to one another. |
